IDI SEMICONDUCTOR LASER CUSTOMISERS

SINGULATE. MARK. CUT. PROCESS.

SCROLL
BEAM ON — 1064 nm
IDI SEMICONDUCTOR LASER CUSTOMISERS

CHOOSE YOUR WAVELENGTH

Choose the laser wavelength and technology to suit your process.

UV (355 nm)
Fine features, precision processing and reduced thermal impact.
Green (532 nm)
High-precision cutting and processing with a balance of speed and heat input.
IR (1 μm+)
Efficient processing and deeper interaction where the material and application require it.
Picosecond / Nanosecond
Pulse duration selected according to material, quality and throughput requirements.
APPLICATION EXAMPLES

WHERE THE LASER WORKS

01 / SINGULATION

Package Singulation

Non-contact laser cutting for semiconductor packages, leadframes, substrates and advanced packaging materials with reduced chipping, mechanical stress and edge damage.

PackagesLeadframesAdvanced packaging
02 / TRACEABILITY

Package Marking

High-speed laser marking and traceability for semiconductor packages and production lines with integrated inspection and verification.

OCR / OCVBarcode / 2D codeSECS/GEM
03 / PRECISION CUTTING

Package & Substrate Cutting

Precision cutting for package strips, PCBs, substrates and difficult materials where conventional mechanical methods may be limited.

Package stripsPCBsSubstrates
04 / CUSTOM PROCESS

Precision Laser Processing

Customized laser processes for drilling, ablation, trimming, surface treatment and other precision manufacturing requirements.

DrillingAblationTrimming